发明名称 PRESSURE SENSITIVE ADHESIVE SHEET FOR LASER DICING, AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a pressure sensitive adhesive sheet for laser dicing which can dice a machining object surely with high productivity efficiency to element pieces in discrete dicing by providing a modified region in the inside of the machining object by optical absorption ablation, and to provide a method for manufacturing element pieces surely with high productivity efficiency by using the pressure sensitive adhesive sheet for laser dicing. <P>SOLUTION: At least an adhesive layer 2 is provided to one surface of a base material 1 of the pressure sensitive adhesive sheet 4 for laser dicing used in discrete dicing, by providing a modified region in the inside of the machining object by optical ablation of laser beam. The projection part of a width (W) of 20 mm or less and a height (h) of 1μm or more and a recess part of a width (W) of 20 mm or less and a depth (d) of 1μm or more do not exist in the surface of the base material 1 which is not in contact with at least the adhesive layer 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005236082(A) 申请公布日期 2005.09.02
申请号 JP20040044188 申请日期 2004.02.20
申请人 NITTO DENKO CORP 发明人 OKAWA YUJI
分类号 B23K26/40;C09J7/02;C09J201/00;H01L21/301;H01L21/68;H01L21/78;(IPC1-7):H01L21/301 主分类号 B23K26/40
代理机构 代理人
主权项
地址