发明名称 WIRE BONDING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To incorporate the earth detecting function of a capillary except a function of transmitting a vibration to the capillary in a piezo-electric element, to enable the ground of the capillary to be detected instantaneously and to reduce the impact load at the grounding time. <P>SOLUTION: A wire bonding apparatus assembles the piezo-electric element 4 near the capillary mounting part of a bonding arm 1 so that the capillary 3 is vibrated in the axial direction of the bonding arm 1, and dives the piezo-electric element 4 by a piezo-electric element driving power source 11. The wire bonding apparatus includes a detector 15 for detecting the voltage generated from the piezo-electric element 4 when the capillary 3 moves down to be grounded, and a bonding arm control circuit 16 for controlling the moving-down of the bonding arm 1 by a voltage or current change detected by the detector 15. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005236103(A) 申请公布日期 2005.09.02
申请号 JP20040044575 申请日期 2004.02.20
申请人 SHINKAWA LTD 发明人 KONDO YUTAKA
分类号 H01L21/60;B23K20/00;B23K31/02;(IPC1-7):H01L21/60 主分类号 H01L21/60
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