| 摘要 |
PROBLEM TO BE SOLVED: To prevent a solid-rich phenomenon in a liquid and to simplify and miniaturize the structure of a liquid ejection apparatus. SOLUTION: The liquid ejection apparatus 1 is for ejecting a conductive adhesive 3 and the conductive adhesive 3 to be ejected contains at least metallic filler. The liquid ejection apparatus 1 is provided with a syringe 4 housing the conductive adhesive 3 and a stirring member 6 for stirring the conductive adhesive 3 housed in the syringe 4. The stirring member 6 stirs the conductive adhesive 3 by moving the metallic filler by electromagnetic induction without being in contact with the conductive adhesive 3. COPYRIGHT: (C)2008,JPO&INPIT
|
