| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic circuit module and a multilayer wiring board that can ensure the connection of a bump of an integrated circuit to a multilayer wiring board by preventing the integrated circuit from being inclined to the multilayer wiring board when the integrated circuit is flip-chip connected to the multilayer wiring board. <P>SOLUTION: This electronic circuit module is equipped with a multilayer wiring board 3 and an integrated circuit 2. The multilayer wiring board 3 is equipped with a multilayer resin substrate 4 formed of resin, a connection electrode 5 and an inner layer electrode 6. The multilayer wiring board 3 has a most-laminated part 7 where the connection electrode 5 and the inner layer electrode 6 are laminated most, each located at 4 corners of the integrated circuit 2. The most-laminated part 7 which is located at each corner at each 4 place in total is arranged so that the center 2g of the integrated circuit 2 is overlapped with the inside of a square formed by connecting one corner to the adjacent corner of the most-laminated parts 7. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
