| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer holder capable of realizing highly precise temperature distribution, preventing deformation or damage of a chuck top in a rapid temperature increase or cooling or pressing caused by probing, maintaining the flatness of the chuck top and realizing exact and highly precise measurement even in repetitive use, and to provide a wafer prober device equipped with the same. SOLUTION: The wafer holder 1 for wafer prober consists of: a chuck top 2 having a chuck top conductor layer 3 on its surface and equipped with a heater 4; a plurality of supporting bars 5 for supporting the chuck top 2; and a bottom substrate 6 having the supporting bars 5 provided thereon. The supporting bars 5 partially support the rear surface side of the chuck top 2. Preferably, the total area of the supporting bars 5 where the chuck top is supported is≤15% of the total area of the rear surface of the chuck top 2. The chuck top 2 may be provided with a cooling module. COPYRIGHT: (C)2009,JPO&INPIT |
