| 摘要 |
<p>To provide a multilayered printed wiring board to which fire retardancy is imparted without using halogen compounds, and which is made to have enhanced thermal conductivity of an insulator layer to make it possible to prevent electronic parts from being damaged at soldering. <??>Insulator layers each formed with a glass cloth impregnated with epoxy resin composition and metal foil layers in each of which a circuit is formed are laminated alternately, the epoxy resin composition includes at least phosphate ester, aluminum hydroxide, silica, calcium oxide, strontium titanate, and iron oxide, and contents of inorganic components in the above-described insulator layer are provided so as to be 8 to 18% by mass of P2O5, 20 to 28% by mass of Al2O3, 0.1 to 0.6% by mass of SiO2, 0.1 to 1.0% by mass of Cl, 15 to 20% by mass of CaO, 0.3 to 0.5% by mass of TiO2, 0.2 to 0.4 of Fe2O3, and 0.1 to 0.3% by mass of SrO in converted values measured by an X-ray fluorescence analysis.</p> |
