发明名称 Thermal spreading for an externally pluggable electronic module
摘要 A cooling apparatus for dissipating heat from an electronic module is disclosed. The cooling apparatus may include a thermally conductive shell having a surface in contact with, and configured to conduct heat away from, the module. The apparatus may also include an electrically insulative layer positioned between, and configured to conduct heat from, the module to the shell. The apparatus may also include an electrical cord, attached to the module that contains a thermally conductive layer in thermally conductive contact with the shell that is configured to conduct heat away from the shell. The apparatus may also include an electrically insulative layer between the thermally conductive layer and an electrical conductor within the electrical cord. The apparatus may also include an electrically insulative layer, positioned between the thermally conductive layer and an electrical cord outer surface, configured to convectively dissipate heat from the thermally conductive layer.
申请公布号 US9414527(B2) 申请公布日期 2016.08.09
申请号 US201414534273 申请日期 2014.11.06
申请人 International Business Machines Corporation 发明人 Mann Phillip V.;O'Connell Kevin M.;Sinha Arvind K.;Stathakis Karl
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人 Williams Robert;Bowman Nicholas D.
主权项 1. A cooling apparatus for dissipating heat from a heat-producing electronic module, the cooling apparatus comprising: a thermally conductive shell having at least one surface in thermally conductive contact with the heat-producing electronic module, and configured to conduct heat away from the heat-producing electronic module, the heat-producing electronic module being an optoelectronic module; a first electrically insulative layer, positioned between the at least one surface of the thermally conductive shell and the heat-producing electronic module and configured to conduct heat from the heat-producing electronic module to the thermally conductive shell; an electrical cord attached to the heat-producing electronic module and containing a thermally conductive layer in thermally conductive contact with the thermally conductive shell, the thermally conductive layer configured to conduct heat away from the thermally conductive shell; a second electrically insulative layer, positioned between the thermally conductive layer and at least one electrical conductor within the electrical cord; and a third electrically insulative layer, positioned between the thermally conductive layer and an outer surface of the electrical cord, and configured to convectively dissipate heat from the thermally conductive layer.
地址 Armonk NY US