Wafer charging electromagnetic inspection tool and method of using

摘要

An electromagnetic inspection tool which includes a stage configured to support a wafer having a first surface and an emitter configured to emit electromagnetic waves to be incident on the first surface. The electromagnetic inspection tool further includes a detector configured to detect electromagnetic waves returned from the first surface and a charging mechanism configured to charge the first surface. A method of electromagnetically inspecting a wafer which includes loading a wafer having a first surface onto a stage and emitting electromagnetic waves to be incident on the first surface. The method further includes detecting electromagnetic waves returned from the first surface and charging the first surface prior to detecting the electromagnetic waves returned from the first surface.

主权项

1. An electromagnetic inspection tool comprising:
a stage configured to support a wafer having a first surface; an emitter configured to emit electromagnetic waves to be incident on the first surface; a detector configured to detect electromagnetic waves returned from the first surface and to output a detection signal based on the electromagnetic waves returned from the first surface; and an induction device positioned along a side of the stage perpendicular to the first surface of the stage configured to support the wafer, wherein the detection signal has a contrast, and the induction device is configured to selectively adjust the contrast of the detection signal based on an amount of charge induced onto the first surface.