发明名称 DEVICE AND METHOD FOR SUBSTRATE HEATING DURING TRANSPORT
摘要 A system for heating substrates while being transported between processing chambers is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed in the transfer chamber. The LEDs may be GaN LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. A controller is in communication with the LEDs. The LEDs may be independently controllable, so that the LEDs that are disposed above the substrate as it is moved from one processing chamber to another are illuminated. In other words, the illumination of the LEDs and the movements of the substrate handling robot may be synchronized by the controller.
申请公布号 WO2016164163(A1) 申请公布日期 2016.10.13
申请号 WO2016US23537 申请日期 2016.03.22
申请人 VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. 发明人 SCHALLER, Jason M.;EVANS, Morgan D.;MORADIAN, Ala;VOPAT, Robert Brent;BLAHNIK, David;WEAVER, William T.
分类号 H01L21/324;H01L21/677;H01L33/00 主分类号 H01L21/324
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