发明名称 半導体装置及び半導体装置の製造方法
摘要 A semiconductor device is provided which includes an N-type semiconductor layer and a P-type semiconductor layer coexisting in the same wiring layer without influences on the properties of a semiconductor layer. The semiconductor device includes a first wiring layer with a first wiring, a second wiring layer with a second wiring, and first and second transistors provided in the first and second wiring layers. The first transistor includes a first gate electrode, a first gate insulating film, a first oxide semiconductor layer, a first hard mask layer, and first insulating sidewall films covering the sides of the first oxide semiconductor layer. The second transistor includes a second gate electrode, a second gate insulating film, a second oxide semiconductor layer, and a second hard mask layer.
申请公布号 JP6013084(B2) 申请公布日期 2016.10.25
申请号 JP20120185332 申请日期 2012.08.24
申请人 ルネサスエレクトロニクス株式会社 发明人 砂村 潤;金子 貴昭;古武 直也;齋藤 忍;林 喜宏
分类号 H01L21/8238;H01L21/28;H01L21/3205;H01L21/768;H01L23/522;H01L27/00;H01L27/092;H01L29/417;H01L29/786 主分类号 H01L21/8238
代理机构 代理人
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