Electrical connection device between two boards and method of use in a microelectronic component

摘要

The device has two contact units integrated with two sides of respective wafers (2, 3). One contact unit has a protruding zone (6) and the other has a beam (7) suspended above a cavity (8) formed in the wafer (3). The width of the zone is smaller than that of the cavity. The zone contacts the beam above the cavity and the pressure exerted by the zone causes a deformation of the beam, when the wafers are assembled. An independent claim is also included for a method for manufacturing a micro-electronic component having an electrical connection device.