| 摘要 |
<P>PROBLEM TO BE SOLVED: To shorten the distance between an inductor provided in a semiconductor chip and an external inductor without impairing a physical protecting function required to a sealing resin layer. <P>SOLUTION: The semiconductor chip 10 is disposed on a first surface of a mounting substrate 100 with its active surface upward. The inductor 20 is provided on an active surface or a surface side of the semiconductor chip 10 which does not face the mounting substrate, and serves for communication between the semiconductor chip 10 and the outside. The sealing resin layer 300 is formed on a first surface of the mounting substrate 100, and seals the semiconductor chip 10. The sealing resin layer 300 is provided with a recess or opening (a recess 310 in this embodiment). The recess 310 includes the inductor 20 therein in plane view. <P>COPYRIGHT: (C)2011,JPO&INPIT |
