| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method for polishing both sides of an object by the predetermined amount while obtaining the high flatness in a short polishing time. <P>SOLUTION: The polishing method includes steps of: setting the polishing rates P, Q of an upper surface plate 35 and a lower surface plate 36 to different values in order to simultaneously polish both sides 10A, 10B of an object 10 and to adjust their thickness to the predetermined thickness To; measuring the polishing amounts L, M of both sides 10A, 10B of the object 10 with a polarized separation film 13 as a reference; polishing the object 10 in the first polishing time X; inverting both sides 10A, 10B of the object 10 with respect to the upper surface plate 35 and the lower surface plate 36; and polishing the inverted object 10 in the second polishing time Y. <P>COPYRIGHT: (C)2011,JPO&INPIT |
