发明名称 |
Integrated circuit packaging system with stacked die and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a flip chip die, having a backside protrusion; mounting a wire bond die on the flip chip die, adjacent to the backside protrusion; and mounting an internal stacking module over the backside protrusion and the wire bond die.
|
申请公布号 |
US7977802(B2) |
申请公布日期 |
2011.07.12 |
申请号 |
US20090398782 |
申请日期 |
2009.03.05 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
PAGAILA REZA ARGENTY;DO BYUNG TAI;CHUA LINDA PEI EE |
分类号 |
H01L23/48;H01L21/44;H01L21/48;H01L23/02;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|