Semiconductor Package with Integrated Output Inductor Using Conductive Clips

摘要

A semiconductor package includes a semiconductor die having a control transistor and a sync transistor, an integrated output inductor having a winding around a core, and coupled to the semiconductor die, where the winding includes a plurality of top conductive clips connected to a plurality of bottom conductive clips. The control transistor and the sync transistor are configured as a half-bridge. The integrated output inductor is coupled to a switched node of the half-bridge. At least one of the plurality of top conductive clips and the plurality of bottom conductive clips includes a partially etched portion and a non-etched portion. The semiconductor die is attached to the integrated output inductor by a die attach material. The semiconductor die and the integrated output inductor are encapsulated in a molding compound.

主权项

1. A semiconductor package comprising:
a semiconductor die comprising a control transistor and a sync transistor; an integrated output inductor comprising a winding around a core, and coupled to said semiconductor die; wherein said winding comprises a plurality of top conductive clips connected to a plurality of bottom conductive clips.