发明名称 LAMINATED ELECTRICAL TRACE WITHIN AN LED INTERCONNECT
摘要 Various apparatuses and methods are disclosed. An interconnect may include molding material configured to support a light-emitting device, and an electrical trace arranged with the molding material to electrically couple the light-emitting device to a power source, wherein the electrical trace has an electrical insulator on at least a portion thereof. A light-emitting apparatus may include a light-emitting device, molding material supporting the light-emitting device, and an electrical trace arranged with the molding, material to electrically couple the light-emitting device to a power source, wherein the electrical trace has an electrical insulator on at least a portion thereof. A method of manufacturing may include providing an electrical trace having an electrical insulator on at least a portion thereof, and forming molding material capable of supporting a light-emitting device, wherein the molding material is formed with the electrical trace configured to electrically couple the light-emitting, device to a power source.
申请公布号 US2016308105(A1) 申请公布日期 2016.10.20
申请号 US201615195907 申请日期 2016.06.28
申请人 XENIO CORPORATION 发明人 NOSKA Brandon
分类号 H01L33/62;H01L33/54;H05K3/00;H01L33/48;H05K1/18;H01L25/075;H01L23/498 主分类号 H01L33/62
代理机构 代理人
主权项 1. An interconnect, comprising: molding material comprising one or more cavities, the molding material configured to support a light-emitting device; an electrical trace arranged with the molding material to electrically couple the light-emitting device to a power source; and an electrical insulator in contact with the one or more cavities, wherein the electrical insulator is arranged with the electrical trace such that the electrical insulator prevents the electrical trace from being exposed through the one or more cavities.
地址 San Francisco CA US