| 发明名称 |
THERMAL RELIEF PAD |
| 摘要 |
A printed circuit board (PCB) having a thermal relief pad around at least one via. The thermal relief pad includes at least four thermal cut-outs and at least four conductive bands. The at least four conductive bands are formed between the at least four thermal cut-outs such that adjacent conductive pads are orthogonal to each other. Each pair of mutually opposite conductive bands have substantially equal lengths and each pair of adjacent conductive bands have unequal lengths. |
| 申请公布号 |
US2016330832(A1) |
申请公布日期 |
2016.11.10 |
| 申请号 |
US201415109177 |
申请日期 |
2014.01.30 |
| 申请人 |
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
发明人 |
Kapoor Mark Vinod;Engler David W. |
| 分类号 |
H05K1/02;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board (PCB) having a thermal relief pad around at least one via, the thermal relief pad comprising:
at least four thermal cut-outs; and at least four conductive bands formed between the at least four thermal cut-outs, wherein:
the adjacent conductive bands from amongst the at least four conductive bands are orthogonal to each other and have unequal lengths, andeach pair of mutually opposite conductive bands have substantially equal lengths. |
| 地址 |
Houston TX US |
