| 发明名称 |
PACKAGE ASSEMBLY |
| 摘要 |
A package assembly includes a main body, a power module and replaceable top cover. The main body has a hollow part. The power module is disposed within a hollow part of the main body and located beside the bottom part of the main body. At least one first pin is disposed on a surface of the power module. The at least one first pin is accommodated within the hollow part of the main body and partially protruded out of a first open end of the hollow part near a top part of the main body. The top cover is disposed in the hollow part of the main body, and includes at least one first opening corresponding to the at least one first pin. The at least one first pin is penetrated through the corresponding first opening and exposed outside the first open end of the hollow part. |
| 申请公布号 |
US2016352245(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201615165719 |
申请日期 |
2016.05.26 |
| 申请人 |
Delta Electronics Int'l (Singapore) Pte Ltd |
发明人 |
Tan Chad-Yao;Chen Da-Jung |
| 分类号 |
H02M7/00;H05K7/14;H05K5/03 |
主分类号 |
H02M7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package assembly, comprising:
a main body having a hollow part, wherein the hollow part runs through a top part and a bottom part of the main body; a power module disposed within the hollow part of the main body and located beside the bottom part of the main body, wherein at least one first pin is disposed on a surface of the power module, and the at least one first pin is accommodated within the hollow part of the main body and partially protruded out of a first open end of the hollow part near the top part of the main body; and a replaceable top cover disposed in the hollow part of the main body, and comprising at least one first opening corresponding to the at least one first pin, wherein the at least one first pin is penetrated through the corresponding first opening and exposed outside the first open end of the hollow part. |
| 地址 |
Singapore SG |
