发明名称 Speicherzellenanordnung und Verfahren zu deren Herstellung
摘要 Several mutually insulated memory cell lines arranged in a semiconductor substrate (21) include each a first doped region (D1') and a second doped region (D2') between which are arranged a gate dielectric (29, 32) which contains a material with charge carriers capturing points and several gate electrodes (WL1', WL2'). The distance between adjacent gate electrodes (WL1', WL2') is smaller than the dimensions of the gate electrodes (WL1', WL2'). Information is stored by introducing charge carriers into the gate dielectric (29, 32). The gate electrodes (WL1', WL2') are preferably produced by a spacer technique.
申请公布号 DE19652547(A1) 申请公布日期 1998.06.18
申请号 DE19961052547 申请日期 1996.12.17
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 HOFMANN, FRANZ, DR., 80995 MUENCHEN, DE;WILLEER, JOSEF, DR., 85521 RIEMERLING, DE;REISINGER, HANS, DR., 82031 GRUENWALD, DE;BASSE, PAUL WERNER V., DIPL.-ING., 82515 WOLFRATSHAUSEN, DE;KRAUTSCHNEIDER, WOLFGANG, DR., 83104 TUNTENHAUSEN, DE
分类号 H01L21/28;H01L21/8246;H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L27/115;H01L21/824 主分类号 H01L21/28
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