| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board with capacitor elements which has the high electric insulation reliability of connection pads for connecting the capacitor elements without cracking a solder resist layer, even if thermal stresses are exerted to corners of openings of the solder resist layer due to thermal stress from solder for connecting the capacitor element connecting pads to the capacitor elements. SOLUTION: On the surface of an insulation board for mounting semiconductor elements, a solder resist layer 10 is formed which has a plurality of connection pads 5a, 5b electrically connected with electrodes of the capacitor elements through solder, and square openings for exposing the plurality of connection pads. Each corner of the opening 10a is rounded in an arcuate shape having a radius of curvature of 50μm or more in a plan view. COPYRIGHT: (C)2005,JPO&NCIPI
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