| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a COF tape capable of responding to a request of a high miniaturization of today's wiring patterns by uniforming pattern widths of wiring patterns without an increase of costs and by improving positioning precision of the wiring patterns. SOLUTION: The manufacturing method of the COF tape comprises the steps of using a tape-shaped long conductor laminated film 10 consisting of a double layer structure of an insulating base material layer 12 such as polyimide or the like, and a conductive material layer 13 such as copper or the like and has a first sprocket hole 14 at both sides of a width direction; forming a wiring pattern 17 and a positioning mark 18 from the conductive material layer inside a widthwise direction of the first sprocket hole 14 by using an etching method or the like, while conveying and positioning by using the first sprocket hole 14; next forming a second sprocket hole 24 inside the widthwise direction of the first sprocket hole 14 on the basis of the positioning mark 18; and thereafter cutting and removing the first sprocket hole 14 at both sides of the widthwise direction of the conductor laminated film 10 by using a metallic mold or the like. COPYRIGHT: (C)2006,JPO&NCIPI
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