发明名称 JOINT METHOD FOR PRINTED-WIRING BOARD AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a joint method for a printed-wiring board that can prevent disconnection at a junction due to heat distortion and transformation of a printed-wiring board, and can secure reliability of a joining terminal as well as electronic devices. SOLUTION: This is a joint method for a printed-wiring board that uses solders 6 and 6c to join copper foil terminals 3 and 3a of a first printed-wiring board 1 and those of a second printed-wiring board 5. The copper foil terminals of the first and second printed-wiring boards include a copper foil terminal 3a in which a through-hole 4 is formed that passes through the first or second printed-wiring board 1 or 5, a solder 6c filled in the through-hole 4 is used to join the copper foil terminals 3a in which the through-hole 4 is formed. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006156892(A) 申请公布日期 2006.06.15
申请号 JP20040348773 申请日期 2004.12.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YOSHIDA HISAHIKO;HIRATA MASAHIKO
分类号 H05K3/36 主分类号 H05K3/36
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