| 摘要 |
PROBLEM TO BE SOLVED: To provide resin seal molding method and device of a semiconductor chip in which the merit of saving the work time (cycle time) and performing automatic control of resin molding can be enhanced by resin sealing a plurality of required semiconductor chips mounted on two substrates individually while compression molding substantially simultaneously with a uniform pressure. SOLUTION: The resin seal molding device 1 comprises members 38 sliding on the horizontal surface of each cavity 37 provided on the lower die 5b side individually, and a means 42 for regulating a resin material 18 to a required pressure through each sliding member 38. At the time of mold clamping a die 5 under that state, each sliding member 38 slides and the regulation means 42 presses the resin material 18 with a uniform regulated pressure through each sliding member thus resin sealing chips 15 mounted on two substrates 14 while compression molding individually and substantially simultaneously with a uniform pressure. COPYRIGHT: (C)2006,JPO&NCIPI
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