| 摘要 |
PROBLEM TO BE SOLVED: To provide a component unit for enhancing the insulation performance without losing heat dissipation performance by solving the problem of deviation of the covered position of an insulation sheet and deterioration in the insulation performance in a circuit to which a high voltage is applied because electronic components are insulated by the insulation sheet in prior arts. SOLUTION: The component unit is configured to include a heat sink 10 formed by laminating an insulator 14 on a board 12 and electronic components 16 mounted on the heat sink 10 and to mount the electronic components 16 in face contact with the insulator 14 of the heat sink 10. Thus, the contact area between the electronic components and the insulator 14 of the heat sink 10 is increased because of the face contact so as to improve the insulation performance without losing the heat dissipation. COPYRIGHT: (C)2006,JPO&NCIPI
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