| 摘要 |
PROBLEM TO BE SOLVED: To simplify a structure of a driving system of the apparatus for processing external circumference of wafer. SOLUTION: The wafer 90 is aligned and allocated to a processing stage 41. This processing stage 41 is rotated around a rotating axis z. The nozzle position adjusting mechanism 46 is synchronized with this rotation. Thereby, when the circular external circumference 91 of the wafer 90 is caused to cross the first axis y crossing in orthogonal the axis z, a supply nozzle 43a for supplying processing fluid is stopped toward the crossing point, namely the position on the axis y separated substantially by the distance equal to the radius of the wafer from the rotating axis. When the cut-away part 92 of the wafer is crossing the axis y, the supply nozzle 43a is slid along the axis y corresponding to variation in the crossing point so that the nozzle 43a is always directed to the crossing point. COPYRIGHT: (C)2006,JPO&NCIPI
|
