| 摘要 |
PROBLEM TO BE SOLVED: To provide an LC composite component which exhibits excellent bendability of a substrate after packaging and high flexure strength by using a multilayer substrate exhibiting high durability against mechanical stress such as bending or stretching and thermal stress, and realizes reduction in size and cost of electronic apparatus such as a portable terminal by ensuring the degree of freedom sufficiently in design of a circuit board being employed in a wireless communication apparatus. SOLUTION: The LC composite component comprises: a multilayer body 3 of ceramic layers 2; a pair of end electrodes 5 formed at the opposite ends of the multilayer body 3; a spiral portion 6 formed on the surface of the multilayer body 3; a pair of gap portions 7 formed on the surface of the multilayer body 3 and insulating the spiral portion 6 from the pair of end electrodes 5; and a reinforcing layer 4 incorporated in the multilayer body 3 in parallel with the ceramic layer 2. Assuming the length of the reinforcing layer 4 is L, the width of the spiral portion 6 is LS and the gap of the pair of gap portions 7 is LG, following relation is satisfied: LS≤L≤LG. COPYRIGHT: (C)2006,JPO&NCIPI
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