| 摘要 |
An electroplating base includes a separate electrically conductive section isolated from an electrically conductive section. An electrically conductive connecting pattern connects the separate electrically conductive section to the electrically conductive section. Electroplating allows establishment of electroplating films on the electrically conductive section and the separate electrically conductive section. A non-conductive path extends in the electroplating base from a point of a non-conductive section to a point of the non-conductive section. The ends of the non-conductive path are connected to the non-conductive section, so that generation of electroplating films is reliably avoided at the ends of the non-conductive path. The obtained non-conductive section and non-conductive path serve to reliably insulate the electroplating film on the electrically conductive section and the electroplating film on the separate electrically conductive section from each other.
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