ABRASIVE AQUEOUS SUSPENSION BASED ON CERIUM AND SILICA DIOXIDE PARTICLES FOR POLISHING SURFACES OF MATERIALS

摘要

The invention concerns an abrasive aqueous suspension for polishing the surface of a material, comprising 0.5 to 4 wt. % of cerium dioxide particles having an average size ranging between 5 and 80 nm and silica particles of specific area ranging between 60 and 400 m²/g. The invention also concerns a method for polishing the surface of a material using said abrasive aqueous suspension.