| 摘要 |
PROBLEM TO BE SOLVED: To reduce heat load applied to a mounted component during a bonding step, also to reduce stress to a connection and a mounting cost, and to keep constant stand-off of an LSI chip. SOLUTION: The LSI chip 1 is mounted on a substrate 2. A line (not shown) and a pad 3 connecting with the line are formed on the substrate 2, and in addition, dummy pads 3a not connected with the line are formed at positions corresponding to four corners of the LSI chip 1. An electrode pad (not shown) of the LSI chip 1 is connected with the pad 3 on the substrate via a conductive adhesive 4. A ball spacer 5 and the conductive adhesive 4 are formed on the dummy pads 3a, and a distance between the LSI chip 1 and the substrate 2 is kept constant by the ball spacer 5. COPYRIGHT: (C)2008,JPO&INPIT |
