| 摘要 |
PROBLEM TO BE SOLVED: To enable easy double-sided analysis of a semiconductor device. SOLUTION: A device for evaluating double-sided analysis, which fixes a package device with a semiconductor chip exposed by removing a part of mould, is provided with a substrate and a cover mounted to the substrate by covering the package device placed on a predetermined region of the substrate. The substrate includes a pad corresponding to a terminal come out from the package of a package arranged in a predetermined region, and a transmission region through which light transmits in a predetermined region. The cover has a cover transmission region for transmitting light at a location corresponding to the light's transmission region when it is mounted to the substrate. The surface of the semiconductor chip can be observed from the cover transmission region and analyzed. The back surface of the semiconductor chip can be observed from the substrate transmission region and analyzed. COPYRIGHT: (C)2009,JPO&INPIT
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