| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation unit which is superior in heat dissipation effect and is capable of being readily assembled. SOLUTION: In the heat dissipation unit, including a heat dissipator provided on an electronic component, a fixed module surrounding the bottom part of the heat dissipator and fixed on a circuit board, and a fixing member for fixing the heat dissipator to the inner side of the fixed module, the fixing member includes two fixing portions separately provided on both sides of the peak part of the heat dissipator, two engaging portions separately connected so as to be turned to the fixing portions, and an operation portion connected so as to be turned to the two fixing portions. When the operation portion is operated, the fixing member is engaged with the fixed module. COPYRIGHT: (C)2009,JPO&INPIT |
