| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device for preventing the surface peeling of a largely scaled package substrate for loading surface mounted optical semiconductor and transparent sealing resin in a high temperature solder reflow process. <P>SOLUTION: The optical semiconductor device including a package mold formed with a recess configured of a bottom face and a side face; a light emitting element placed on the bottom face of the recess; and transparent sealing resin packed in the recess by covering the light emitting element. A light emitting device extracts the rays of light from the interface of the transparent sealing resin and air, and the area of the bottom face of the recess is ≥7 mm<SP>2</SP>, and an angle made by the section where the side face of the recess is brought into contact with the bottom face and a horizontal face is ≤45°. <P>COPYRIGHT: (C)2009,JPO&INPIT |
