METHOD FOR POSITIONALLY STABLE SOLDERING

摘要

A method for positionally stable soldering of at least one component part contact face (11) of an electronic component part (1) to at least one corresponding carrier plate contact face (12) of a carrier plate (2), said method having the following steps:
a) mounting at least two adhesive points (3a, 3b, 8a, 8b, 9a, 9b) on the carrier plate (2), wherein the position of each adhesive point (3a, 3b, 8a, 8b, 9a, 9b) is predefined,b) fitting the printed carrier plate (2) with the at least one electronic component part (1), wherein the position of the adhesive points (3a, 3b, 8a, 8b, 9a, 9b) is predefined in step a) in such a way that the at least one electronic component part (1) contacts the at least two adhesive points (3a, 3b, 8a, 8b, 9a, 9b) substantially in an edge region formed by the at least one side face (5a, 5b, 5c, 5d) and the lower face 6 and the at least one component part contact face (11) at least partially overlaps the at least one carrier plate contact face (12),c) waiting for completion of a curing process of the adhesive points (3a, 3b, 8a, 8b, 9a, 9b) for a predefinable period of time t,d) heating the solder material (13) in order to establish an electrical, mechanical and/or thermal connection between the at least one component part contact face (11) and the at least one carrier plate contact face (12).

主权项

1. A method for positionally stable soldering of at least one component part contact face (11) of an electronic component part (1) to at least one corresponding carrier plate contact face (12) of a carrier plate (2), wherein the at least one electronic component part (1) has a lower and upper face (6 and 4) and also at least one side face (5a, 5b, 5c, 5d) connecting the lower face to the upper face (6 and 4), wherein the at least one component part contact face (11) is formed on the lower face (6) and the at least one carrier plate contact face (12) at least partly has solder material (13), wherein the electronic component part (1) is an optoelectronic component part, the method comprising:
a) mounting at least two adhesive points (3a, 3b, 8a, 8b, 9a, 9b) on the carrier plate (2), wherein the position of each adhesive point (3a, 3b, 8a, 8b, 9a, 9b) is predefined; b) fitting the carrier plate (2) with the at least one electronic component part (1), wherein the position of the adhesive points (3a, 3b, 8a, 8b, 9a, 9b) is predefined in step a) in such a way that the at least one electronic component part (1) contacts the at least two adhesive points (3a, 3b, 8a, 8b, 9a, 9b) substantially in an edge region formed by the at least one side face (5a, 5b, 5c, 5d) and the lower face 6 and the at least one component part contact face (11) at least partially overlaps the at least one carrier plate contact face (12); c) waiting for completion of a curing process of the adhesive points (3a, 3b, 8a, 8b, 9a, 9b) for a predefinable period of time t; and d) heating the solder material (13) in order to establish an electrical, mechanical and/or thermal connection between the at least one component part contact face (11) and the at least one carrier plate contact face (12).