WAFER RECONFIGURATION

摘要

At least one water is embedded in a carrier to eliminate or at least reduce edge effect. The wafer reconfiguration is designed to improve a quality not only for spin coating process but also for electric plating process. An edge bead is formed on top of the carrier instead of being formed on top of the wafer so that a full top surface of the wafer can be active to the fabrication of chips and therefore more chips are yielded for a single wafer. The backside of the wafer is not contaminated by the coating according to the present invention. Further, dummy circuits can be made on top of the carrier so that electric plating uniformity tor full area of a wafer can be improved.

主权项

1. A wafer reconfiguration, comprising:
a carrier; at least one wafer received in a space in the carrier; and a sealing material filled in a gap between the wafer and the carrier, wherein a top surface of the sealing material is coplanar with a top surface of the carrier and a top surface of the wafer.