CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PRODUCT OF SAME AND SEMICONDUCTOR DEVICE WHICH USES SAID CURED PRODUCT

摘要

This curable resin composition for semiconductor encapsulation contains at least: a polysiloxane compound having at least two functional groups, which are selected from the group consisting of silanol groups and alkoxysilyl groups, in each molecule (component (A-1)); and a silica, extracted water of which has a pH of 6.1 or less at 25°C (component (B)). The ratio of the component (B) to the total amount of the component (A-1) and the component (B) is from 70% by mass to 97% by mass (inclusive). This composition is able to be suppressed in foaming at the time of curing even in cases where this composition is formed into various shapes and sizes, and is useful as an encapsulation material for semiconductor devices.