Package for an implantable device

摘要

The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.

主权项

1. A biocompatible hermetic package for an implantable retinal prosthesis, comprising:
a planar base including an electrically non-conductive substrate and a plurality of electrically conductive hermetic vias through the non-conductive substrate, and biocompatible metallization on the non-conductive substrate; an integrated circuit bonded directly to a first side of the base with conductive bumps, wherein the integrated circuit is smaller than the base defining a bonding region on the first side of the base between the integrated circuit and the edge of the base; a circuit element electrically connected directly to the base in the bonding region; a cover bonded to the first side of the base, the cover and the base forming a biocompatible hermetic package; and a polymer body, including a strap, supporting the package and including suture tabs suitable to attach the package to tissue, wherein an outside of the hermetic package, including a second side of the base opposite the first side, is biocompatible ad suitable to contact tissue.