| 发明名称 | Adhesive film | ||
| 摘要 | Provided is an adhesive film capable of being used to encapsulate or capsulate an OED. The adhesive film includes an adhesive layer whose surface has at least one groove for exhausting air. | ||
| 申请公布号 | US9422460(B2) | 申请公布日期 | 2016.08.23 |
| 申请号 | US201414268883 | 申请日期 | 2014.05.02 |
| 申请人 | LG Chem, Ltd. | 发明人 | Yoo Hyun Jee;Chang Suk Ky;Shim Jung Sup;Cho Yoon Gyung;Lee Seung Min |
| 分类号 | C09J7/00;B32B37/12;H01L51/52;C09J163/00 | 主分类号 | C09J7/00 |
| 代理机构 | Dentons US LLP | 代理人 | Dentons US LLP |
| 主权项 | 1. An adhesive film for capsulating an organic electronic device, which comprises an adhesive layer, on the surface of which at least one groove for exhausting air having a width of 20 μm to 1 mm and a height of 1 to 10 μm is formed, wherein the adhesive layer has a multi-layered structure, and a groove for exhausting air is formed on a surface of the outermost adhesive layer of the multi-layered adhesive layer. | ||
| 地址 | Seoul KR | ||