| 发明名称 |
Colloidal silica chemical-mechanical polishing concentrate |
| 摘要 |
A chemical-mechanical polishing concentrate includes at least 10 weight percent of a colloidal silica abrasive particle dispersed in a liquid carrier having a pH in a range from about 1.5 to about 7. The colloidal silica abrasive includes an aminosilane compound or a phosphonium silane compound incorporated therein. The concentrate may be diluted with at least 3 parts water per one part concentrate prior to use. |
| 申请公布号 |
US9422457(B2) |
申请公布日期 |
2016.08.23 |
| 申请号 |
US201514750107 |
申请日期 |
2015.06.25 |
| 申请人 |
Cabot Microelectronics Corporation |
发明人 |
Grumbine Steven;Dysard Jeffrey;Shen Ernest;Cavanaugh Mary |
| 分类号 |
C09G1/02;B24B1/00;C09G1/00;C09G1/04;C09K3/14;H01L21/306;H01L21/321;H01L21/3105 |
主分类号 |
C09G1/02 |
| 代理机构 |
|
代理人 |
Omholt Thomas;Homilla Arlene;Streinz Christopher C. |
| 主权项 |
1. A chemical-mechanical polishing concentrate comprising:
a water based liquid carrier; at least 10 weight percent colloidal silica abrasive particles dispersed in the liquid carrier; an aminosilane compound or a phosphonium silane compound incorporated in the colloidal silica abrasive particles internal to an outer surface thereof; and a pH in a range from about 1.5 to about 7. |
| 地址 |
Aurora IL US |
