Liquid ejecting apparatus, head unit, and method of controlling liquid ejecting apparatus

摘要

A liquid ejecting apparatus includes: a modulation circuit that generates a modulated signal obtained by performing pulse modulation on a source signal; a transistor that amplifies the modulated signal to generate an amplified modulated signal; a lowpass filer that smoothes the amplified modulated signal to generate a driving signal; a piezoelectric element that is displaced when the driving signal is applied; and a circuit substrate on which the modulation circuit, the transistor, and the lowpass filter are mounted. The transistor includes a die, a first electrode, a second electrode, a third electrode, a conductive die pad, a first lead which is electrically connected to the second electrode by a bonding wire, and a second lead which is electrically connected to the third electrode by a bonding wire. The die pad, the first lead, and the second lead are electrically connected to different wiring patterns of the circuit substrate.

主权项

1. A liquid ejecting apparatus comprising:
a modulation circuit that generates a modulated signal obtained by performing pulse modulation on a source signal; a transistor that amplifies the modulated signal to generate an amplified modulated signal; a lowpass filer that smoothes the amplified modulated signal to generate a driving signal; a piezoelectric element that is displaced when the driving signal is applied; a cavity of which an internal volume changes through the displacement of the piezoelectric element; a nozzle that is formed to eject a liquid in the cavity according to the change in the internal volume of the cavity; and a circuit substrate on which the modulation circuit, the transistor, and the lowpass filter are mounted, wherein the transistor includes a die that forms the transistor, the die has first and second surfaces opposite to each other, and the first surface faces the circuit substrate, a first electrode that is formed the first surface of the die, second and third electrodes that are formed on the second surface of the die, a conductive die pad that is electrically adhered to the first electrode, a first lead which is electrically connected to the second electrode by a bonding wire, and a second lead which is electrically connected to the third electrode by a bonding wire, wherein the die pad, the first lead, and the second lead are electrically connected to different wiring patterns of the circuit substrate, and wherein the first electrode, the die pad, and one of the different wiring patterns are stacked so that the first electrode is electrically connected to the one of the different wiring patterns.