发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To reduce leakage current while reducing current collapse.SOLUTION: A semiconductor device 1 includes: a compound semiconductor layer 13 provided on a substrate 10; a compound semiconductor layer 14 which is provided on the compound semiconductor layer 13 and has a band gap larger than that of the compound semiconductor layer 13; and a gate electrode 17 provided on the compound semiconductor layer 14. A gate length of the gate electrode 17 is larger than twice the thickness of the compound semiconductor layer 13 and not larger than five times the thickness of the compound semiconductor layer 13.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016167499(A) |
申请公布日期 |
2016.09.15 |
申请号 |
JP20150045976 |
申请日期 |
2015.03.09 |
申请人 |
TOSHIBA CORP |
发明人 |
OMA KOHEI;TAKADA KENJI;YOSHIOKA AKIRA;ISOBE YASUHIRO;HUNG HUNG |
分类号 |
H01L21/338;H01L21/28;H01L21/336;H01L21/337;H01L27/098;H01L29/06;H01L29/41;H01L29/778;H01L29/78;H01L29/808;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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