SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

According to one embodiment of the present invention, disclosed are a semiconductor device and a manufacturing method thereof. The technical objective of the present invention is to provide a semiconductor device and a manufacturing method thereof, to use normal bumping equipment, so as to have an interposer not having a through-silicon via (TSV). To this end, the semiconductor device comprises: an interposer including a redistribution layer and a protection layer to cover the redistribution layer; a semiconductor die penetrating the protection layer of the interposer to connect to the redistribution layer; and a resin to mold the semiconductor die. The interposer is formed to sequentially form a first seed layer and a first redistribution layer under the protection layer, a bump seed layer penetrating the protection layer is directly formed on the first seed layer, and a micro bump pad connected to the semiconductor die is formed on the bump seed layer.