METHOD FOR FORMING EM-PROTECTED SEMICONDUCTOR DIE

摘要

PROBLEM TO BE SOLVED: To provide a method for forming an die protected from the EM of a semiconductor wafer at low cost, in a semiconductor device which is rather protected from the electromagnetic (EM) interference or EMI.

SOLUTION: Semiconductor dies 12, 13 and 14 are formed so as to have sloped sidewalls 35, 36 and 37. Conductors 40 are formed on the sloped sidewalls and bottom surfaces of the semiconductor dies. The conductors 40 which are conductive materials protect the dies 12 to 14 from EMI.

COPYRIGHT: (C)2011,JPO&INPIT