| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly-reliable semiconductor device and a method of manufacturing the same.SOLUTION: A semiconductor device according to this embodiment comprises: a wiring board; a first semiconductor chip arranged on the wiring board; a support member arranged in a region not overlapped with the first semiconductor chip in a plan view from a direction vertical to the wiring board, on the wiring board; a resin member arranged on the first semiconductor chip; and a second semiconductor chip arranged on the support member and the resin member. In a method of manufacturing a semiconductor device according to this embodiment, the first semiconductor chip is arranged in a first region on the wiring board, and the support member is arranged in a second region on the wiring board, and the resin member is arranged at least a part on the first semiconductor chip, and the second semiconductor chip is arranged on the support member and the resin member.SELECTED DRAWING: Figure 3 |
