| 摘要 |
PROBLEM TO BE SOLVED: To provide a die improved in releasability by a simple structure, a method for controlling the die, and a semiconductor device produced by the die.SOLUTION: Provided is a die 10 comprising: a first die 20 having a first cavity 21 of forming a first sealing part 5; and a second die 40 having a second cavity 41 of forming a second sealing part 6.The first die 20 includes: at least either a first pin 22 applied when the first sealing part 5 is released from the first die 20 or a first runner pin 32 applied when a runner molding 4r formed at a runner part 13 is released from the first die 20; at least either a first pin passage 24 arranged in combination with the first pin 22 or a first runner pin passage 34 arranged in combination with the first runner pin 32; and a gas introduction part 29 of introducing a compressed gas GS to at least either the first pin passage 24 or the first runner pin passage 34.SELECTED DRAWING: Figure 6 |
