| 摘要 |
The invention relates to an electronics module comprising a semiconductor unit (14) in a plastic housing (12), and an electrically conductive plate arrangement (16) via which the semiconductor unit (14) can be supplied with electric power and which is connected in a planar manner to a heat-generating integrated circuit (14b) of the semiconductor unit (14) via a heat coupling element (18), the electrically conductive plate arrangement (16) being designed in such a way as to dissipate the heat generated by the heat-generating integrated circuit (14b) of the semiconductor unit (14) to the plastic housing (12). The invention further relates to a method for producing a corresponding electronics module. |
