Substrate processing apparatus and substrate processing method

摘要

A processing liquid is supplied onto a substrate rotated by a spin chuck in a coating processing unit so that a film of the processing liquid is formed, and a rinse liquid is supplied to a peripheral edge of the substrate so that a processing liquid on the peripheral edge of the substrate is removed. An edge cut width between a position of an outer peripheral portion of the substrate rotated by the spin chuck in an edge exposure unit and a position of an outer peripheral portion of a film on the substrate is detected. Based on the detected edge cut width, a positional deviation of the center of the substrate held in the spin chuck from a rotation center of the spin chuck in the coating processing unit is determined while a supply state of the rinse liquid by an edge rinse nozzle is determined.

主权项

1. A substrate processing apparatus that processes a substrate having an outer peripheral portion, at least a part of which is circular, comprising:
a film formation unit that forms a film of a processing liquid on the substrate; a detection unit that detects a state of the substrate after film formation by said film formation unit; and a controller that makes determination based on a detection result of said detection unit, wherein said film formation unit includes a first rotating and holding device that holds and rotates the substrate, a processing liquid supplier that supplies the processing liquid onto the substrate rotated by said first rotating and holding device, to form a film of the processing liquid, and a removal liquid supplier that supplies a removal liquid to a peripheral edge of the substrate rotated by said first rotating and holding device, to remove the processing liquid on the peripheral edge of the substrate, said detection unit includes a second rotating and holding device that holds and rotates the substrate, and a position detector that detects a position of the outer peripheral portion of the substrate rotated by said second rotating and holding device and a position of an outer peripheral portion of the film on the substrate, and said controller determines a positional deviation of the center of the substrate held in said first rotating and holding device from a rotation center of said first rotating and holding device based on the position of the outer peripheral portion of the substrate and the position of the outer peripheral portion of the film on the substrate, which have been detected by said position detector, while determining a supply state of the removal liquid supplied by said removal liquid supplier in said film formation unit based on the position of the outer peripheral portion of the substrate and the position of the outer peripheral portion of the film on the substrate, which have been detected by said position detector, wherein the supply state of the removal liquid includes a position of a supply nozzle that supplies the removal liquid to the outer peripheral portion of the substrate from said removal liquid supplier.