| 摘要 |
<p>PCT No. PCT/EP97/00673 Sec. 371 Date Aug. 12, 1998 Sec. 102(e) Date Aug. 12, 1998 PCT Filed Feb. 13, 1997 PCT Pub. No. WO97/31129 PCT Pub. Date Aug. 28, 1997The pin for electronic assemblies according to the present invention consists of a core alloy with 0.2 to 1.5 wt. % Ag, the remainder copper, whereby at least the contact surface of the pin is provided with one or several highly conductive and/or easily solderable coatings. With this not only a higher electric conductivity of the contact is obtained but also a comparatively high strength with simple production and good workability, which makes it possible to miniaturize the pins.</p> |
