| 摘要 |
A planar workpiece such as a semiconductor wafer is polished and cleaned by polishing a surface of the planar workpiece by pressing the surface against a first abrasive member which is rotating about its own axis, under a predetermined pressure, and scrubbing the surface with a second abrasive member of a non-woven cloth, a cloth other than a non-woven cloth, or a wiping cloth of ultrafine fibers, which is held against the surface, while scrubbing the surface with the second abrasive member. The surface of the planar workpiece is pressed against the second abrasive member under a predetermined pressure while the second abrasive member is making circulatory translational motion along a predetermined path. <IMAGE> |
