发明名称 Semiconductor circuits and devices on germanium substrates
摘要 A semiconductor device having at least one layer of a group III-V semiconductor material epitaxially deposited on a group III-V nucleation layer adjacent to a germanium substrate. By introducing electrical contacts on one or more layers of the semiconductor device, various optoelectronic and microelectronic circuits may be formed on the semiconductor device having similar quality to conventional group III-V substrates at a substantial cost savings. Alternatively, an active germanium device layer having electrical contacts may be introduced to a portion of the germanium substrate to form an optoelectronic integrated circuit or a dual optoelectronic and microelectronic device on a germanium substrate depending on whether the electrical contacts are coupled with electrical contacts on the germanium substrate and epitaxial layers, thereby increase the functionality of the semiconductor devices.
申请公布号 US2002168809(A1) 申请公布日期 2002.11.14
申请号 US20010850773 申请日期 2001.05.08
申请人 BOUTROS KARIM S.;KARAM NASSER H.;KRUT DIMITRI;HADDAD MORAN 发明人 BOUTROS KARIM S.;KARAM NASSER H.;KRUT DIMITRI;HADDAD MORAN
分类号 H01L29/267;H01L29/737;H01L31/103;(IPC1-7):H01L29/06;H01L31/032 主分类号 H01L29/267
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