发明名称 Etching process to selectively remove copper plating seed layer
摘要 Write head coils for magnetic disk systems are commonly formed through electroplating onto a seed layer in the presence of a photoresist mask. It is then necessary to remove the seed layer everywhere except under the coil itself. The present invention achieves this through etching in a solution of ammonium persulfate to which has been added the complexing agent 1,4,8,11 tetraazundecane. This suppresses the reduction of Cu++ to Cu, thereby increasing the dissolution rate of copper while decreasing that of nickel-iron. Two ways of implementing this are described-adding the complexing agent directly to the ammonium persulfate and introducing the 1,4,8,11 tetraazundecane through a dipping process that precedes conventional etching in the ammonium persulfate.
申请公布号 US2002168223(A1) 申请公布日期 2002.11.14
申请号 US20020170106 申请日期 2002.06.12
申请人 HEADWAY TECHNOLOGIES, INC. 发明人 WU XUE HUA;LI WENSEN;LAM SI-TUAN;CHANG HENRY C.;JU KOCHAN;CHANG JEI-WEI
分类号 C23F1/18;F16B7/02;G11B5/17;G11B5/31;H05K1/05;H05K3/06;(IPC1-7):F16B2/18;F16B7/04 主分类号 C23F1/18
代理机构 代理人
主权项
地址
您可能感兴趣的专利